Where is thermal paste applied during the installation of a processor?

Thermal paste is applied between the heat sink and the CPU to enhance thermal conductivity. Its primary purpose is to fill microscopic gaps and imperfections on these surfaces, ensuring that heat is effectively transferred from the CPU to the heat sink. A proper application of thermal paste is crucial for maintaining efficient cooling, which helps prevent the CPU from overheating during operation.

When the CPU generates heat, the heat sink is responsible for dissipating that heat into the environment. If there is insufficient thermal interface material, such as thermal paste, the heat transfer will be less effective, leading to higher temperatures and potential thermal throttling or damage to the CPU. Thus, applying thermal paste directly between the heat sink and the CPU is essential for optimal cooling performance.